| 摘要 |
PURPOSE:To enable the connection wirings be intersected as well as a large and small wirings to be formed for enhancing the design freedom in the IC chip assembling process by properly using both conductive and insulating pastes. CONSTITUTION:A gap between a package 21 and a semiconductor chip 11 is gently filled up with a groove filler 16 so that the electrodes 12 of said chip 11 and the other electrodes of package may be connected in almost flat state by wirings formed in arbitrary size using a conductive paste 13 while the intersecting parts of said wirings may be insulated using an insulating paste 14. Said pastes 13, 14 are discharged from a fine nozzle to make thread type wirings by decelerating the moving speed of nozzle for making large wirings while accelerating the same for making small wirings. Through these procedures, the design freedom in IC chip assembling process can be enhanced. |
