| 发明名称 |
GOLD ALLOY WIRE CONNECTION TO COPPER DOPED ALUMINUM SEMICONDUCTOR CIRCUIT INTERCONNECTION BONDING PAD |
| 摘要 |
The disclosure relates to an electrical connection between a bonding pad on a semiconductor chip and a wire wherein the bonding pad is formed of copper doped aluminum and the wire is formed of copper doped gold. The wire has from about 100 to about 10,000 parts per million copper and the pad has from about 5000 to about 50,000 parts per million copper. |
| 申请公布号 |
EP0288776(A3) |
申请公布日期 |
1989.03.22 |
| 申请号 |
EP19880105266 |
申请日期 |
1988.03.31 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
BROOK, RICHARD M.;RAMSEY, THOMAS H. |
| 分类号 |
H01L21/60;H01L21/607;H01L23/49;H01L23/532 |
主分类号 |
H01L21/60 |
| 代理机构 |
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