| 摘要 |
<p>PURPOSE:To lessen the amount of positional deviation of semiconductor pellets at the time of pickup of the semiconductor pellets by a method wherein an extensible sheet and a strong adhesive sheet are laminated to each other. CONSTITUTION:A semiconductor wafer is adhered on an extensible sheet 1 and after the wafer is formed into semiconductor pellets by dicing and cracking, this sheet 1 is extended to separate the pellets 2 from one another. After this, the sheet 1 is held on a cylindrical expansion ring 4 using a rubber 3, while a flat ring 5 with a strong adhesive sheet 6 adhered thereon is prepared and this ring 5 is fixed on a ring holder 7. Then, the ring 4 is placed and fixed on this holder 7 in such a way that the ring 4 is made to cover on this holder 7. Then, these sheets 1 and 6 are closely contacted to each other and are laminated to each other. Thereby, even in case the pellets 2 on the sheet 1 are picked up when a pellet attaching is performed, a change in the tension of the sheet 1 is not almost generated as there exists the sheet 6 and the positional deviation of the pellets 2 can be lessened.</p> |
