| 摘要 |
A four-leaded dual in-line package is disclosed in which a rectangular insulation housing carries a semiconductor device therein which is connected to flat lead frame elements which extend out through the opposite sides of the insulation housing and define two pairs of in-line leads on opposite respective sides of the insulation housing. Two leads on one side of the package are insulated from one another and the two leads on the other side of the package are joined together. The two leads which are joined together extend from a flat heat sink frame section which carries a semiconductor chip in good heat-conduction relationship. The device within the package is disclosed as a three-electrode MOS transistor. Other devices can be contained within the housing. The insulation housing surrounding the in-line leads extends beyond the centers of the leads by a distance equal to one-half of the center-to-center spacing between leads. The entire package is a module which can be stacked end to end with identical modules, with the adjacent leads of two modules having the same center-to-center spacing from one another as the center-to-center spacing between the two leads on each side of each module. Thus, individual modules can be stacked together, for example, to form a sixteen-lead quad. The extending leads of the single or stacked modules can plug into a standard DIP socket. |
