| 摘要 |
PURPOSE:To prevent members from loosely contacting due to the difference of disposition, thermal expansion coefficients in a semiconductor of a structure in which a pellet having pad plated electrodes is held by heat sinks on both sides and sealed with a glass bulb by connecting the electrodes of the pellet to the heat sinks with high melting point solder. CONSTITUTION:A pellet 1 having pad plated electrodes 2 is held on both sides by heat sinks 4 at which small amounts of high melting point solders 3 are bonded in advance to the sides to be connected with the pellet, and sealed with a glass bulb. 5. The solders 3 are melted due to the temperature rise in case of sealing to connect the electrodes 2 to the sinks 4. |
