发明名称
摘要 <p>PURPOSE:To lower the series resistance of a diode without making operating efficiency lower than conventional devices by connecting a lead terminal and a chip electrode in parallel while the upper section of the chip electrode is used as a turning point. CONSTITUTION:A diode is composed of a diode chip 2 being fixed onto a substrate 1 and having a chip electrode 3, lead terminals 4 oppositely arranged to the substrate 1, and wires 6 connecting the lead terminals 4 and the chip electrode 3 in parallel while the upper section of the chip electrode 3 is employed as a turning point. The diode chip 2 is fastened to the substrate 1, the wire 6 is connected to the chip electrode 3 from the lead terminal 4, and the wire 6 is folded back and connected to the lead terminal 4 from the chip electrode 3 as the procedure of the assembly. Lastly, an outer circumference is covered under the state in which the substrate 1 and the nose sections of the lead terminals 4 are exposed, and the whole is sealed with a molding resin 7 as shown in a broken line. Accordingly, the series resistance of the diode can be made lower than one wire as seen in conventional devices.</p>
申请公布号 JPS6464229(K1) 申请公布日期 1989.03.10
申请号 JP19870221527 申请日期 1987.09.03
申请人 发明人
分类号 H01L23/48;H01L21/60;H01L23/12;H01L29/861 主分类号 H01L23/48
代理机构 代理人
主权项
地址