| 摘要 |
PURPOSE:To enable an accurate and efficient junction and to enhance connection reliability, by absorbing deformation and contraction generated in a wiring substrate by joining the wiring substrate to each electrode of IC pellet through a metal lead foil which is fixed on the film substrate. CONSTITUTION:In a circuit substrate unit 7, an IC pellet 10 and a capacitor 11 are mounted on a first film substrate 7a and a second one 7b, respectively, and both are connected through conductive metal lead foils 7c. Of the metal lead foils 7c, two metal lead foils 7c, 7c are extended to the second film substrate 7b and the other metal lead foils 7c are connected to connection electrodes 6d of a wiring substrate 6 through an anisotropic conductive adhesion 18. In this case, the film substrate 7b is connected to the first film substrate 7a only through a metal lead foil 7c consisting of a copper foil so that it can be easily bent at right angle and spring back can also be prevented. |
