| 摘要 |
PURPOSE:To prevent impurities from penetrating between an external lead and an internal lead and improve the moisture-resistant properties of a semiconductor device by a method wherein the internal lead and the external lead are separately provided and the internal lead is connected to the external lead with a second bonding wire. CONSTITUTION:A semiconductor element 1 is mounted on an element mounting part 2 and the electrode pad 1a of the element 1 is connected to an internal lead 3 with a bonding wire 5. The internal lead 3 is provided separately from an external lead 4. The internal lead 3 is connected electrically and mechanically with a second bonding wire 7. Even if impurities penetrate through the gap between the lead 4 and resin 6 to the inside of the resin 6, as the gap between the wire 7 and the resin 6 is very narrow, the impurities do not leach the lead 3 through the gap. With this constitution, the moisture-resistant properties of the semiconductor device can be improved. |
