| 摘要 |
PURPOSE:To manufacture a hybrid integrated circuit substrate having a preferable thermal conductivity by bonding a metallized metal layer to a metal plate by a brazing material having a higher melting point than that of a normal solder, and reflow-soldering an electronic component to a circuit face under a temperature condition of the melting point of the solder or above and the melting point of the brazing material or below. CONSTITUTION:A metal layer 16 is metallized on the other side face of a ceramic plate 11 formed with a circuit on one side face, and the layer 16 is bonded by brazing with a brazing material 18, such as tin having higher melting point than that of a solder 31. Then, an electronic component 32 is placed through the solder 31 on the circuit face of the plate 11, and the component 32 is reflow soldered onto the circuit face under temperature condition of the melting point of the solder 31 or above to the melting point of the material 18 or below. Thus, a hybrid integrated circuit substrate having preferable thermal conductivity can be manufactured, thereby manufacturing a hybrid integrated circuit substrate for generating large quantity of heat, such as a power semiconductor module substrate, etc. |
