发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent shortcircuits caused by contacts of an exposed metal wire with other parts by forming an area in which to remove an insulator of a coated wire inside the end face of a semiconductor chip when forming a metal pole on the tip in the supply side of the coated wire. CONSTITUTION:When forming a metal ball 5A1 on the tip in the supply side of a coated wire 5, a melted area 5A2 (the insulator 5B is melted), wherein an insulator 5B of the coated wire 5 is removed by melting and the metal wire 5A is exposed as a result, is formed so that it can be located inside an end face of a semiconductor chip 2 (so as to give it a dimension alpha). According to the constitution, the end face of the semiconductor chip 2 comes into contact with the insulator 5B of the coated wire 5, and therefore, shortcircuits caused by contacts between the melted area 5A and the end face of the semiconductor chip 2 can be prevented.
申请公布号 JPS6442831(A) 申请公布日期 1989.02.15
申请号 JP19870200561 申请日期 1987.08.10
申请人 HITACHI LTD 发明人 OKIKAWA SUSUMU
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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