| 摘要 |
<p>PURPOSE: To enable mass production by providing a metal laminate formed on a metal slice, separated by and from an electric insulation layer integrated with at least one of metal electrodes and chip semiconductor element electrically contacted and fixed to this laminate. CONSTITUTION: Inside a synthetic resin body 4 are provided a metal laminate 12, provided on a metal slice 2 separated by and from an electric insulation layer integrated with at least one of metal electrodes 10 and a chip semiconductor element 14, electrically contacted and fixed to this laminate 12. A first chip semiconductor element 6, including an integrated circuit, is fixed to the slice 2 by, e.g. brazing the base electrode and slice surface. Thus it is possible to manufacture a semiconductor device in a 'multi-watt' type standard case, using the same machine and manufacturing process as is usually used for the semiconductor device manufacturing and hence, enables executing a very economical mass production.</p> |
