| 摘要 |
PURPOSE:To execute a recovery operation of a wafer block automatically and without relying on a manual operation by a method wherein, after the wafer block attached to a semiconductor single-crystal rod has been clamped with a clamping mechanism by using a main movable part and an auxiliary movable part, the clamping mechanism is turned around its tip part. CONSTITUTION:A piston rod 22b of a clamping cylinder 22 is advanced; both clamping arms 20, 20 are turned around a pin 21 in a horizontal direction; an attached material of a semiconductor single-crystal rod 2 is clamped by both clamps 23, 23. In addition, a piston rod 17a of a turning cylinder 17 is advanced; a turning frame 18 interlinked with the piston rod 17a is turned around the clamp 23 downward. By this setup, a number of wafer blocks are separated from the semiconductor single-crystal rod 2, are held firmly by both clamps 23, 23 and are placed on a support stage 7c. A main movable part 3 retreats together with the wafer blocks; the wafer blocks are recovered smoothly. |
