发明名称 MOLDING RESIN MOLDER
摘要 PURPOSE:To simplify the constitution of a release means as well as to contrive a reduction in the size of a device, improvement of the rigidity of the device and simplification of the structure of the device by a method wherein the release of a molded product is performed by spraying air. CONSTITUTION:A molding material inserted in a pot 35 is pressed by a plunger arranged over a top force 21 and a fused resin, which is the molding material, is poured in cavities 27. If the resin is cured, the air from air supply units is fed in ports 28 through air supply pipelines 29. Thereby, the air fed in the ports 28 is divided into the upper and lower sides with a lead frame 30 as a boundary, the divided air intrudes into the cavities and a product is released simply from the top force 21 and a bottom force 22.
申请公布号 JPS6428833(A) 申请公布日期 1989.01.31
申请号 JP19870183394 申请日期 1987.07.24
申请人 HITACHI LTD;HITACHI HOKKAI SEMICONDUCTOR LTD 发明人 TABATA KATSUHIRO;OSAKA SHINGO;KURATOMI BUNJI
分类号 B29C45/02;B29C45/40;B29C45/43;B29L31/34;H01L21/56 主分类号 B29C45/02
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