| 摘要 |
PURPOSE:To prevent mutual re-adhesion of a contaminant of adjacent silicon substrates onto the fronts and the rears and to improve the washing effect by installing heat-resistant and chemical-resistant resin sheets at regular intervals and mounting carriers for washing the substrates for batch treatment isolating the surfaces and rears of adjacent semiconductor substrates. CONSTITUTION:A material excellent in heat resistance and chemical re sistance in the same manner as a main body is used as resin sheets 2, and the resin sheets 2 constitute the shape of carriers while being joined with structural materials 3 for reinforcement. Positioning guides at the time of the insertion of silicon substrates on both sides of the carriers are set up to the upper sections of the carriers and at the central sections of the carriers. A resin board having the same curvature as the diameter of the corresponding silicon substrate is employed as the guide 6, and a groove into which the silicon substrate is introduced by approximatety 1-2mm is notched. The guide 7 is joined with a cover 10 in an upper section to such an extent as to be deformed easily. |
