| 摘要 |
<p>PURPOSE:To perform soldering connection of a semiconductor chip to an external circuit without requiring formation of a bump by a complicated process, by using an electroless plating method to form a barrier metal layer on an aluminum wiring and composing a wiring part of a chip. CONSTITUTION:In a semiconductor chip 1 with an Al wiring 2 and a passivation film 3 on its surface layer, the wiring part is connected to the external circuit by soldering. Then the wiring part of the chip 1 is formed of a barrier metal layer 4 on the wiring 2 by an electroless method. The barrier metal layer 4 is made of one element selected from gold, silver, copper, nickel, or cobalt. Soldering connection of the chip 1 to the external circuit is performed without requiring formation of the bump by a complicated process.</p> |
