| 摘要 |
PURPOSE:To obtain an semiconductor element which ensures superior cost and reliability by providing a thermal adhesive sheet wherein spherical conductive fillers having each diameter smaller than the height of each Au bump are dispersed in thermal adhesive polymeric materials on the semiconductor element consisting of Au bumps. CONSTITUTION:A semiconductor element has bumps which are formed by performing Au electrolytic plating. And thermal adhesive sheets which are prepared by dispersing conductive fillers in the whole surface of the conductive element are laminated. An LSI chip can be electrically connected with ITO and eliminates the need fop metallizing ITO, resulting in the reduced cost of products. In other words, the formation of the thermal adhesive sheets wherein the conductive fillers are dispersed on the Au bumps makes its chip exhibit anisotropic property and its thermocompression bonding allows its chip to be connected with ITO. Having elasticity, each filler has a spherical form and its average particle diameter is smaller than the height of the Au bump which is provided at a pad part of the LSI chip and the surface is coated with metallic plating. An highly excellent property of connection in the conductive fillers can be obtained by spheric ones, because elasticity of the fillers makes their distortions among a large number of the bumps uniform. |
