EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE,申请号JP19870155590-传众专利搜索

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发明名称	EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE
摘要
申请公布号	JPS641754(A)	申请公布日期	1989.01.06
申请号	JP19870155590	申请日期	1987.06.24
申请人	SUMITOMO BAKELITE CO LTD	发明人	FUJIEDA YOSHIO
分类号	C08L63/00;C08G59/00;C08G77/42;C08G77/442;C08L83/04;C08L83/10;H01L23/29;H01L23/31	主分类号	C08L63/00
代理机构		代理人
主权项
地址

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