| 摘要 |
PURPOSE:To provide a copper alloy which has low stress relaxation at high temps. and does not contain expensive Be by incorporating specific amounts of Ni, Sn and Mn into copper. CONSTITUTION:Said copper alloy contains, by weight, 5-30% Ni, 3-10% Sn, 0.01-2% Mn and the balance Cu. As the auxiliary elements, one or more kinds among 0.0001-5% total among 0.01-1% Si and Fe, 0.01-5% Zn, 0.01-2% Co and Al, 0.001-0.2% Mg, Zr and Nb, 0.001-0.1% As, Cr, Ti, Sb, Pb and Ag, 0.001-0.03% P, 0.0001-0.03% B and 0.0001-0.1% lanthanoids may furthermore be incorporated into said Ni, Sn and Mn. In Ni and Sn, the sufficient age hardening characteristics can not be obtd. in the case of less than the lower limit, the electroconductivity is lowered in the case of more than the upper limit and the bendability is also lowered in Sn. In Mn, the strength becomes insufficient since the deposition of the high concd. layer of Ni and Sn occurs in the case of less than the lower limit and the electroconductivity is lowered in the case of more than the upper limit.
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