发明名称 ELECTRONIC PART TAPING APPARATUS
摘要 PURPOSE:To perform an efficient and stable taping operation aimed at the speed-up of product processing by sequantially electrode-cutting an electronic part and inserting the same into an emboss tape while delivering the electronic part supplied and received in a rotary receiving drum in as-framed condition. CONSTITUTION:An electronic part 1b received normally in a rotary receiving drum 3 is intermittently sent to an electrode cut mechanism 5 where the same is cut in a manner similar to the scissors action by an electrode cut ring 5b and an electrode cut edge 5a in conformity with the width of an electrode lead. Next, the electronic part 1b after undergoing the electrode cut is sucked by a vacuum suction mechanism 15 and delivered in this posture. When the electronic part 1b is intermittently sent to an inserting mechanism 6 located in a lower position by the rotary receiving drum 3, a suction nozzle 51 moves downwardly with the electronic part 1b adhered thereto and then the electronic part 1b inserted into an emboss tape 8 is supplied to a heat seal mechanism 11 where a heater iron moves downwardly from a predetermined point in synchronism with the intermittent feeding of the emboss tape 8 so as to heat seal the emboss tape 8 and a cover tape 10 together.
申请公布号 JPS63317408(A) 申请公布日期 1988.12.26
申请号 JP19870146624 申请日期 1987.06.11
申请人 MITSUBISHI ELECTRIC CORP 发明人 SUDA YOSHINOBU;NAKAOKA KIYOTAKA;SHIMOMURA TAKAYOSHI
分类号 B65B15/04;H05K13/02 主分类号 B65B15/04
代理机构 代理人
主权项
地址