SHIELDING PACKAGE FOR SURFACE MOUNTING COMPONENT

摘要

PURPOSE:To improve a shielding effect with a simple construction by connecting the cap of a package to the shielding pattern of a circuit substrate through a conductive material. CONSTITUTION:A multilayer printed substrate 1 is covered with the cap 50 of a shielding package to connect the shielding pattern of the substrate 1 to the cap 50 by a conductive solder 53 at the peripheral edge of the substrate 1. Thus, an electromagnetic shielding effect is remarkably enhanced as compared with the case that the cap is merely covered.