| 摘要 |
PURPOSE:To facilitate the installation and removal of an IC socket on and from a printed board by a method wherein an elastic connecting terminal pin is provided to protrude from below through an insulating layer and an LSI lead is allowed to go under pressure into a hole in the contact section of the pin. CONSTITUTION:A pin section 12-1 capable of slidably going into a through-hole 3-1 in a printed board 3 and a contact section 12-2 capable of receiving under pressure an LSI lead 4 are provided. A narrow slit 12-3 is provided along the length of an outwardly elastic contact terminal 12. The contact terminal 12 is accommodated in a hole 11-1 provided in an insulating layer 11 and its pin section 12-1 protrudes from below. When the LSI lead 4 is pushed into the contact section 12-2, the slit 12-3 expands, enlarging the pin section 12-1 in outer diameter for the establishment of connection between the printed board 3 and LSI. When the LSI lead 4 is pulled out of the contact section 12-2, the pin section 12-1 recovers its original size on its own elasticity. This facilitates the removal of an IC socket from the printed board 3.
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