Polyimide resin composition.

摘要

The invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention consist of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high-temperature engineering polymer. The polyimide consists of recurring units of the following formula: <CHEM> wherein X is direct bond, thio radical, or o- or p-phenylene dicarbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, <CHEM> The high-temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: <CHEM> aromatic polysulfone consisting of recurring units of the formula: <CHEM> or aromatic polyetherimide consisting of recurring units of the formula: <CHEM>