| 发明名称 |
Method of making circuit assembly with hardened direct bond lead frame |
| 摘要 |
In an electric circuit assembly (2) having conductive lead frames (8-10) directly bonded to an insulating substrate (6) by a eutectic, the lead frames are further subjected to a work hardening step (32, 34) to stiffen the lead frames and enable push-on fastener connection (12) to the lead frames without collapse thereof. |
| 申请公布号 |
US4788765(A) |
申请公布日期 |
1988.12.06 |
| 申请号 |
US19870120626 |
申请日期 |
1987.11.13 |
| 申请人 |
GENTRON CORPORATION |
发明人 |
KAUFMAN, LANCE R.;DOMBECK, JOHN A.;FREDERICKSON, HERBERT O. |
| 分类号 |
H01L23/495;H01R43/16;(IPC1-7):H01R43/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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