| 摘要 |
PURPOSE:To prevent the occurrence of a solder bridge at the rear side even if the solder deposition is performed on the basis of the front end side, by limitedly depositing a solder resist between the lands located at a specific position of the land sections of a wiring pattern to which the IC leads are soldered. CONSTITUTION:In a plurality of land sections 5(51...5n) to which leads 4(41...4n) are respectively soldered, a solder resist is extendedly deposited in a belt-like shape on the adjacent land sections 51 and 52 located at one side of the arrangement section thereof, and at least the solder resist 6 is prevented from being deposited between the land sections 5n-1 and 5n located at the end opposite thereto. If the soldering work is performed so that an appropriate amount of solder is deposited at the land section 5n side of the front end, the occurrence of a solder bridge by the solder resist 6 is avoided between the adjacent land sections 51 and 52 at the rear end side of the arrangement section of the land sections 5 where the solder deposition tends to be made in an excessive amount.
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