| 摘要 |
PURPOSE:To form a plated layer of a uniform thickness on the surface of a material to be plated by placing a metallic chip made of the same metal as the anode between the anode and the material to be plated as the cathode in an electroplating cell so as to control the current density distribution of electric current for plating. CONSTITUTION:The cathode 3 and the anode 4 are arranged in a plating cell 1 filled with a plating bath 2, an L-shaped metallic material 5 to be plated is fitted to the surface of the cathode 3 and electric current is supplied between the electrodes 3, 4 to form a plated layer 8 of a metal on the surface of the material 5. At this time, a chip 6 made of the same metal as the anode 4 and having low electric resistance is placed near the corner of the material 5 on which a plated layer is hardly formed with a support rod 7 made of a material proof against the bath 2. By the presence of the chip 6, the current density distribution of electric current for plating is allowed to flow uniformly even to the corner of the material 5 and the plated layer 8 of a uniform thickness can be formed on the surface of the material 5 including the corner.
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