发明名称 |
RF transistor package with capacitor |
摘要 |
A semiconductor device comprising a conductive layer; an insulting layer mounted on the conductive layer and having an opening; terminals deposited on the insulating layer; an active semiconductor element mounted on the conductive layer or the insulating layer, and; a capacitor mounted on the conductive layer. In this device, a path between the semiconductor element and the capacitor is very short and the conductive layer serves as a heat sink.
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申请公布号 |
US4788584(A) |
申请公布日期 |
1988.11.29 |
申请号 |
US19880166731 |
申请日期 |
1988.03.02 |
申请人 |
FUJITSU LIMITED |
发明人 |
HIRANO, YUTAKA;ITOH, MASANOBU;IZUMI, AKIRA;DOOI, YOSHIKAZU |
分类号 |
H01L23/12;H01L23/14;H01L23/66;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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