| 摘要 |
<p>PURPOSE:To facilitate changing transfer parts and setting the distance between the transfer parts at a predetermined value by a method wherein the two transfer parts can be positioned by mating means and the distance between the two transfer parts is predetermined in accordance with the size of a semiconductor wafer. CONSTITUTION:A 1st transfer part 10 is fixed to a base 13 and a rubber belt 16 is moved by the rotation of 1st and 2nd pulleys 14 and 15 and a semiconductor wafer can be carried by placing it on the rubber belt 16. Protrusions 17 for positioning are provided on the base 13. The relative position between the transfer part 10 and a main part 12 is determined by mating the protrusions 17 with recesses 18 of the main part 12 which are so formed as to be mated with the protrusions 17. A transfer part 11 has the same construction as the transfer part 10. The transfer part 11 is also fixed to the main part 12 by mating the protrusions 17 with the recesses 18 of the main part 12 so as to select the distance between the transfer parts 10 and 11 corresponding to the size of a wafer carrier housing the semiconductor wafer to be conveyed, i.e., corresponding to the size of the semiconductor wafer.</p> |
