发明名称 COOLING MECHANISM OF ELECTRONIC EQUIPMENT
摘要 PURPOSE:To miniaturize a device and to improve a heat radiating effect, by providing exposed parts of metallic base layers, in a laminated body, wherein insulating plates, on which wiring layers are provided, and the metallic base layers are laminated, and attaching electronic parts, which yield heat, to said exposed parts tightly. CONSTITUTION:Insulating plates,on which wiring layers are provided, and metallic base layers are laminated in a multilayered printed wiring board 5 having the metallic base layers. Exposed parts 6 of the metallic base layers 91 and 92 are provided in the wiring board 5. Electronic parts 2, which yield heat, are tightly attached to the exposed parts 6. The base layer 91 and 92 serve the role of heat radiation. In this constitution, the device can be miniaturized, and the heat radiating effect can be enhanced.
申请公布号 JPS63292079(A) 申请公布日期 1988.11.29
申请号 JP19870127048 申请日期 1987.05.26
申请人 ASIA ELECTRON KK 发明人 TAKAGI NOBUYOSHI
分类号 G01R31/26;G01R31/28;H05K1/00;H05K1/02;H05K1/05;H05K1/18 主分类号 G01R31/26
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