发明名称 MOLDING METHOD FOR HOLLOW PACKAGE FOR SEALING ELEMENT
摘要 PURPOSE:To reduce the manufacturing cost of a product for which an element such as a silicon tip or the like is utilized and enhance reliability by molding a container main body with a first mold and also molding integrally a cover on an opening section of the container main body with a second mold. CONSTITUTION:A lead frame 3 inserted into a first mold 5 is placed on along an upper surface 7d, a side surface 7e and a channel 7c of a projected section 7a of a bottom force 7. In said state, the mold is closed and molten resin heated up to a given temperature is injected from a gate 6b into a cavity 8 and filled therein to mold a container main body 1 integrated with the lead frame 3. Next, an element 4 is bonded with the lead frame, and the container main body 1 is inserted into a second mold 9 after interconnection is carried out. Said container main body 1 is inserted into a recessed section 10a of a bottom force 10 and the lead frame 3 is placed in a channel 10c. In said state, a slide core 12 is moved to close an opening section of the container main body 1. A lower end surface 14c of a surface section 14a of a pressing component 14 is adjusted to a bottom surface 11b of a recessed section 11 of top force 11. Then, the mold is closed and molten resin heated up to a given temperature is injected from a gate 11c into a cavity 13 and filled therein to mold a cover 2.
申请公布号 JPS63290716(A) 申请公布日期 1988.11.28
申请号 JP19870126700 申请日期 1987.05.23
申请人 MITSUBISHI METAL CORP 发明人 OBARA MITSUHIRO
分类号 B29C45/14;B29C45/16;B29L31/56 主分类号 B29C45/14
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