发明名称 LIQUID-COOLED MODULE
摘要 PURPOSE:To reduce the number of components while improving the cooling efficiency, by providing heat pipes so as to extend through the inside of bellows having a flange secured to one end thereof. CONSTITUTION:Each of heat pipes 13-1 which are long enough to reach a liquid path 12b is arranged vertically to a heat conducting fitting 13-2 so as to seal a cooling medium. A cooling assembly 13 in which the fitting 13-2 is fixed closely to the end face of a bellows 13-3 is secured to each of apertures 12a in a body 12. When cooling liquid is pressure-fed through a pipe 4-1 of the body 12, the cooling liquid flows through the liquid path 12b as indicated by the two-dot chain line and strikes against the tip ends of the pipes 13-1 to cool the fittings 13-2 heated by the LSi's 1-1. In this manner, the number of components can be reduced while improving the cooling efficiency.
申请公布号 JPS63283048(A) 申请公布日期 1988.11.18
申请号 JP19870118330 申请日期 1987.05.14
申请人 FUJITSU LTD 发明人 MOCHIZUKI MASAHIRO;INOUE KATSUMI;SUZUKI MASAKAZU
分类号 H05K7/20;H01L23/427;H01L23/46;H01L23/473;H05K7/14 主分类号 H05K7/20
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