| 摘要 |
PURPOSE:To obtain the titled composition outstanding in moisture resistance and soldering heat resistance, for use in electrical and electronic parts, etc., by blending an epoxy resin, novolak type phenolic resin and each specified amount of Si-NCO bond-contg. silyl isocyanate compound and inorganic filler. CONSTITUTION:The objective composition can be obtained by blending (A) an epoxy resin, (B) a novolak type phenolic resin, (C) a Si-NCO bond-contg. silyl isocyanate compound (e.g., trimethyl silyl isocyanate) and (D) inorganic filler (pref., silica powder). The amounts of the above components to be blended are such as follows: 1. the component C ... 0.01-5wt.% based on the whole resin composition, 2. the component D ... 25-90wt.% based on the whole resin composition furthermore, pref. 3. equivalent ratio of the epoxy group in the component A to the phenolic hydroxyl group in the component B ... 0.1-10.
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