摘要 |
PURPOSE:To accelerate largely the temperature-rising speed of a hot plate, by adjusting the gap between an electromagnetic coil and the hot plate. CONSTITUTION:The title equipment is provided with an electromagnetic coil 4 and a hot plate 5 which is subjected to induction heating by the electromagnetic coil. On the upper surface of the hot plate 5, a wafer W is mounted. The hot plate 5 is provided with a temperature controlling equipment which detects the plate temperature and controls it so as to be in a set range. In addition, a gap adjusting mechanism 14 is provided to adjust the gap between the electromagnetic coil 4 and the hot plate 5. By changing the gap between the electromagnetic coil 4 and the hot plate 5, the temperature is rapidly risen. By changing a supplying current to the electromagnetic coil 4, an accurate temperature control for fine variation is performed. Thereby, the temperature- rising speed can be increased, and the throughput of a resist hardening equipment is improved.
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