| 摘要 |
PURPOSE:To reduce remarkably contamination of the surface of a resin-coated paper due to spots, by adding a specific amt. of boron compound in particle chips and/or an adhesive and heat-bonding an amino resin paint-coated decorative paper. CONSTITUTION:A boron compound is contained in particle chips and/or an adhesive in such a ratio that 0.005-1.5 pts. wt. of boron is contained based on 100 pts. wt. of total dry chips. Any compound containing boron can be used as the boron compound, e.g., one or a mixture of two or more selected from boric acid, sodium borate (borax), ammonium borate, sodium borohydride, sodium perborate and so on can be used. As particle chips, such particle chips that are usually used for particle boards can be used. And, a particle board can be used for preparing a decorative particle board where a particle board is heat-bonded with an amino resin paint-coated decorative paper.
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