| 摘要 |
A projection type exposure device includes a main projection objective lens for projecting onto a wafer a predetermined pattern on a negative plate to be projected, a main illuminating optical system including a condenser lens for illuminating the negative plate to be projected, and an alignment optical system for forming the image of a reference mark provided on the negative plate to be projected and the image of an alignment mark on the wafer through the main projection objective lens from between the condenser lens and the main projection objective lens. The alignment optical system has a first objective lens and a second objective lens for condensing the light beam from the first objective lens, the first and second objective lenses being disposed on the same optical axis, and a reflecting member for bending the optical axis so that it is orthogonal to the negative plate to be projected. The first objective lens and the reflecting member are movable together relative to the negative plate to be projected. |
