| 发明名称 |
Patterned semiconductor body |
| 摘要 |
The invention relates to a further development in accordance with German Patent Application P 3545238.2. The invention relates to an electrical connection between at least two semiconductor components which have been produced using different semiconductor technologies. A buried semiconductor layer is used for the connection.
|
| 申请公布号 |
DE3716471(A1) |
申请公布日期 |
1988.10.20 |
| 申请号 |
DE19873716471 |
申请日期 |
1987.05.16 |
| 申请人 |
LICENTIA PATENT-VERWALTUNGS-GMBH |
发明人 |
KUISL,MAX,DR.RER.NAT. |
| 分类号 |
H01L21/74;H01L27/06;(IPC1-7):H01L27/06;H01L21/203;H01L21/22;H01L21/225;H01L21/265;H01L21/76;H01L21/88 |
主分类号 |
H01L21/74 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
