发明名称 MANUFACTURE OF WAFER INTEGRATED CIRCUIT
摘要 PURPOSE:To enhance the reliability of a wiring part by a method wherein crossing circuit extraction wiring parts are formed in a definite manner, points to be connected in order to constitute a desired circuit structure are selected from said crossing points and an interlayer connection is executed at these points so that circuit blocks are wired. CONSTITUTION:It is supposed that circuit blocks A-F arranged in a row are identical ones and that arbitrary four blocks out of them are selected as objects where the circuit blocks are connected with one another. For example, after the circuit blocks A-F have been tested, the circuit blocks A, B, D, F to be used are selected; if external connection terminals (i) and (j) of the blocks are to be connected in the following manner; (i) of A and (i) of B; (i) of D and (i) of F; (j) of A and (j) of D; (j) of B and (j) of F. These connections are realized if an interlayer connection is executed at points indicated by black round marks out of crossing points between interblock wiring parts 1(2a)-1(6A) and circuit extraction wiring parts 3. By this setup, a process is simplified and the reliability of a wiring part is enhanced as compared with a conventional method where, after formation of a wiring part, the wiring part is made to differ according to a difference of a circuit block to be used.
申请公布号 JPS63250151(A) 申请公布日期 1988.10.18
申请号 JP19870085562 申请日期 1987.04.07
申请人 FUJITSU LTD 发明人 KANASUGI AKINORI
分类号 H01L21/82;H01L21/3205;H01L21/822;H01L23/52;H01L27/04 主分类号 H01L21/82
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