ELECTROLESS PLATING METHOD FOR SPUTTRED ITO WIRING PATTERN ON PANEL GLASS

摘要

PURPOSE:To apply electroless plating selectively to an ITO wiring pattern by subjecting a glass surface applied with the sputtered ITO wiring pattern successively to etching, catalyzing treatment and electroless plating, then etching the electroless plating layer and subjecting the same again to the electroless plating. CONSTITUTION:The glass surface roughened by sputtering is first smoothed by an etching soln. and is then subjected to the catalyzing treatment and the electroless plating by which the electroless plating is applied on the glass and the ITO wiring pattern at the time of subjecting the sputtered ITO wiring pattern of panel glass to the electroless plating. The electroless plating layer on the ITO wiring pattern is then etched by an etchant treatment and thereafter, the electroless plating is executed again to form the electroless plating layer only on the ITO wiring pattern. The sputtered ITO wiring pattern on the glass panel is thereby selectively applied with the electroless plating.