| 摘要 |
PURPOSE:To contrive the betterment of positioning accuracy and the improvement of throughput by a method wherein, with a wafer chucking means rotated, a wafer is transferred in the transfer direction by a position adjusting mechanism. CONSTITUTION:A wafer 9 is carried out of a wafer loader 1 and the coarse matching of the orientation flat of the wafer is executed in a prealignment part 2. This coarsely matched wafer 9 is sent to an observation stage part 5 by a belt to be pressed to the stage part 5 by a jig 7 for alignment, sucked by a vacuum chuck 8 and the jig 8 is lowered. After this, the movement to an observation point is executed by the rotation of the chuck 8 and the movement to the X direction and a roatator 10 incorporated with an image rotating prism in such a way that the observation image of a microscope part 3 becomes always an erected image is rotated by a rotary motor unit 11. Thereby, a device can be miniaturized, the positioning accuracy is advanced and the throughput can be improved. |
