发明名称 PROCESS FOR MAKING AN ELECTRICALLY CONDUCTIVE ADHESIVE CONNECTION
摘要 A method of manufacturing an electrically conductive adhesive bond between electrically conductive parts whose surfaces to be bonded exhibit a certain surface roughness, the surfaces to be bonded each being provided with a layer of at least one transition element of the first and/or second transition series of the periodic system of elements, which layer has a surface roughness in the mu m-range, such a quantity of an electrically non-conductive adhesive being used to form the adhesive bond that the raised portions of the transition-element-layer are still in contact with each other.
申请公布号 EP0237114(A3) 申请公布日期 1988.10.12
申请号 EP19870200360 申请日期 1987.03.02
申请人 PHILIPS PATENTVERWALTUNG GMBH;N.V. PHILIPS' GLOEILAMPENFABRIEKEN 发明人 HIEBER, HARTMANN, DR.-ING.;THEWS, WOLFGANG
分类号 H01L21/60;H01R4/04;H01R43/00;H05K3/32;H05K3/40;(IPC1-7):H01R4/00 主分类号 H01L21/60
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