发明名称 |
PROCESS FOR MAKING AN ELECTRICALLY CONDUCTIVE ADHESIVE CONNECTION |
摘要 |
A method of manufacturing an electrically conductive adhesive bond between electrically conductive parts whose surfaces to be bonded exhibit a certain surface roughness, the surfaces to be bonded each being provided with a layer of at least one transition element of the first and/or second transition series of the periodic system of elements, which layer has a surface roughness in the mu m-range, such a quantity of an electrically non-conductive adhesive being used to form the adhesive bond that the raised portions of the transition-element-layer are still in contact with each other. |
申请公布号 |
EP0237114(A3) |
申请公布日期 |
1988.10.12 |
申请号 |
EP19870200360 |
申请日期 |
1987.03.02 |
申请人 |
PHILIPS PATENTVERWALTUNG GMBH;N.V. PHILIPS' GLOEILAMPENFABRIEKEN |
发明人 |
HIEBER, HARTMANN, DR.-ING.;THEWS, WOLFGANG |
分类号 |
H01L21/60;H01R4/04;H01R43/00;H05K3/32;H05K3/40;(IPC1-7):H01R4/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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