发明名称 COOLER FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enhance cooling effect, to average thermal distribution and to reduce a thermal stress by spirally composing a cooling medium passage, and alternately forming going and returning parts. CONSTITUTION:A lower cooler 9 has a cooling passage alternately and spirally disposed in going and returning parts 6, 7, and coolant stream ports 2, 2' are formed at the ends. An upper cooler 8 is composed of metal having larger hardness than that of the cooler 9, and has spiral protrusions 10. The protrusions 10 are so formed as to be disposed both at the parts 6, 7 of the cooler 9, and when both the coolers 8, 9 are superposed, the protrusions 10 are intruded into the cooler 9 to be pressurized. Thereafter, the outer periphery of the bonded part of the coolers 8, 9 is secured by means of a brazed part 12.
申请公布号 JPS63241956(A) 申请公布日期 1988.10.07
申请号 JP19870074336 申请日期 1987.03.30
申请人 TOSHIBA CORP 发明人 TATEISHI YORIO
分类号 H01L25/11;H01L23/40;H01L23/46;H01L23/473 主分类号 H01L25/11
代理机构 代理人
主权项
地址