| 摘要 |
PURPOSE:To manufacture a semiconductor device, which requires a protective film having a specified thickness at a specified position, efficiently with few steps, by forming the protective film by a printing method. CONSTITUTION:When a semiconductor device having a protective film 12 is manufactured, the protective film 12 is formed by a printing method. For example, an element required for constituting a DRAM in each part 14, which is divided as a chip of a semiconductor wafer 13, is formed. Thereafter, on said semiconductor wafer 13, an SiO2 layer 9 forming an insulating layer, an Al wiring layer 10 and an SiN layer forming a first surface protective film are sequentially formed. A bonding pad 4 and a window 11A for providing a contact are formed in the SiN layer 11. Then a recess part 19 in an original plate 17 for intaglio printing is filled with a polyimide resin 18. The plate 17 is pushed on the SiN layer 11, and the polyimide layer 12 is printed and formed on the entire surface of the SiN layer other than the part of the window 11A of the SiN layer 11. The polyimide layer 12 is hardened by heat treatment.
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