发明名称 POLISHING METHOD AND DEVICE THEREFOR
摘要 PURPOSE:To enable execution of stable and highefficient polishing, by a method wherein, when a workpiece is polished in an immersed state in a polishing agent, by agitating the polishing agent, desired polishing grain size distribution is formed in the polishing agent, and a polishing position is polished as polishing particle having a desired grain size is fed. CONSTITUTION:The desired grain size of polishing grain in a polishing agent 40 is set, and a set value is inputted to a control device 56 for memory. Based on a drive command from the control device 56, an ultrasonic oscillator 42 oscillates at a first amplitude to agitate a polishing agent 40 to form first grain size distribution where polishing grain with a high grain size is situated in a low position and a polishing grain with a low grain size in a high position. The part to be polished of a workpiece 60 is set, a polishing agent in a polishing position level is taken in through a polishing agent intake pipe 46a to measure a grain size, and when the measurement is a desired grain size, polishing is effected. During polishing, by means of a command from the control device 56, a motor 32 is run to rotate a polishing tool 34. After polishing of a desired position is completed, a similar motion is made on a subsequent position to be polished, and through repetition of movement in directions (x) and (y) of the polishing tool, the workpiece can be uniformly polished.
申请公布号 JPS63232933(A) 申请公布日期 1988.09.28
申请号 JP19870062601 申请日期 1987.03.19
申请人 CANON INC 发明人 NAKAMURA NOBUO
分类号 B24B13/00;B24B37/00 主分类号 B24B13/00
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