| 摘要 |
PURPOSE:To sufficiently dry a semiconductor wafer without contamination by holding the wafer in a state floating in the air with clean gas from diffusing holes formed at the top and bottom of a body. CONSTITUTION:When a semiconductor wafer 1 is dried, water droplets adhered to the wafer 1 is exhausted from an exhaust port 6 formed at the lower center of a drying device, clean gas 5 is diffused from the bottom to the top from a lower diffusing hole 4 formed at the bottom of the device, clean gas 3 is diffused from the top to the bottom of the device from a top diffusing hole 2 formed at the top of the device, and the gases 3, 5 diffused from the holes 2, 4 are exhausted from an exhaust slit 7 formed at the inner wall of the device. Accordingly, the wafer 1 can be floated in the air of substantially the same height as that of the slit 7 in the device for a predetermined time. Thus, the wafer can be sufficiently dried without contamination.
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