| 摘要 |
PURPOSE:To perform a lead processing with good accuracy by a method wherein positioning holes are provided at sites, whose positions are moved corresponding to the contraction of a molding resin. CONSTITUTION:A lead frame is anew provided with reference parts 20. That is, these reference parts 20 are coupled with the extension parts of tiebars 14 which are the coupling parts for leads and a supporter 12 for holding a chip mounting part 11, are provided at positions where are not connected to an outer frame 16 and a partition frame 19 and moreover, respectively have an area capable of providing a positioning hole 21, in which a guide pin of a hole diameter of 1-2 mm for positioning is inserted, and are formed into a form which is not deformed by inerting the guide pins and so on in these positioning holes 21. In such a way, the positioning of the processing positions of the lead parts to a lead processing mold can be performed with high precision on the basis of the positioning holes 21 of the reference parts 20 in a lead processing process. Thereby, a proper lead processing can be performed and a lead frame of good quality for a semiconductor device can be obtained. |
