| 发明名称 |
SUBSTRATE WIRING PATTERNS FOR MOUNTING INTEGRATED-CIRCUIT CHIPS |
| 摘要 |
<p>An IC chip connects to a substrate by a pattern of pads arranged in single lines along the radial edges of segments of a polygon underlying the chip-linear conductors from the pads cross the outer edge of the segments in parallel groups. Wider power conductors can also be placed in the pattern.</p> |
| 申请公布号 |
EP0116119(B1) |
申请公布日期 |
1988.09.07 |
| 申请号 |
EP19830110496 |
申请日期 |
1983.10.21 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
JOHNSON, CHARLES LUTHER;RYBA, JOHN MICHAEL |
| 分类号 |
H01L23/52;H01L21/60;H01L23/498;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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