发明名称
摘要 PURPOSE:To reduce the cost a lead frame by providing the first metal-plated layer on a part of the lead frame whereon an element is mounted, and the seccond metal-plated layer only on other part than the above. CONSTITUTION:Only a part of a lead 1 whereon a semiconductor element is mounted is plated with an Au film, and other part than the above is plated with an Ag film. By this constitution, the cost of the frame can be reduced while the adhesiveness of the element and the joining property of fine metal wires are maintained as usual, and in addition, since the metal films of different kinds are formed adjacently, the surface of the material of the frame is not exposed and thus the corrosion of the material is prevented.
申请公布号 JPS6343898(B2) 申请公布日期 1988.09.01
申请号 JP19820092777 申请日期 1982.05.31
申请人 NIPPON ELECTRIC CO 发明人 KOJIMA TOMOAKI;OKU TOMOICHI;WADA HITOSHI
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
代理机构 代理人
主权项
地址