| 摘要 |
PURPOSE:To stabilize a power source-ground level by disposing pattern wirings at the periphery of grooves or holes of a square-shaped chip formed with the grooves or the holes therein, and disposing bonding pads at the sides for surrounding the wirings. CONSTITUTION:A slender groove is cut from the center of one side 5 of an LSI chip 1 toward its center, and a bonding pad 3 is also disposed on the sides 2 of the groove. Thus, electric characteristics, such as stabilization of a power source-ground level near the center of a large-sized LSI chip are improved. When the groove or hole is formed, the are of the chip is reduced, but since the area is proportional to the square of the side length, it does not affect a large influence to the area of the whole chip.
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