发明名称 METHOD AND STRUCTURE FOR SEALING ELECTRONIC COMPONENT
摘要 PURPOSE:To perform conduction to only a terminal frame and thus perform the continuous automatic assembly of electronic components by conduction from conduction terminals provided on a terminal built-in frame supported by the terminal frame. CONSTITUTION:A plurality of terminals parts and at least two conduction terminal parts 11-14 are projected outward between a pair of parallel supporting bands 8 and 9 respectively. Then, the terminal frame 2 constituted by supporting, at a constant pitch, the terminal built-in frame 10 with supporting pieces 17 and 18 for an electronic component element projected inward, and a pair of upper and lower cases 3 and 4 composed of thermoplastic resin having a recess for containing the electronic component element 1 are prepared. The electronic component element 1 is mounted on the supporting pieces 17 and 18 of the terminal frame 2, which frame 2 is held between the cases 3 and 4 frame above and below. Conduction is performed to be terminal built-in from 10 from the conduction terminals 15 and 16, thus generating heat, and accordingly the end surfaces of the cases are fusion-welded to each other, thereafter the terminal built-in frame 10 is cut off from the supporting bands.
申请公布号 JPS59126653(A) 申请公布日期 1984.07.21
申请号 JP19830001593 申请日期 1983.01.07
申请人 MURATA SEISAKUSHO:KK 发明人 YAMAMOTO TAKASHI
分类号 H01L23/08;H01L23/02;H01L23/495;H03H3/007;H03H9/02 主分类号 H01L23/08
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