发明名称 ELECTRONIC COMPONENT MOUNTING SYSTEM
摘要 <p>An electronic component mounting system for locating and mounting electronic components on a printed circuit board, the system being capable of mounting any shape of component without damaging the component. The system comprises a vacuum fastener for suction of an electronic component, which component is carried on a tape. A carrier carries the vacuum fastener between a picking up position and a mounting position. An image sensor is responsive to the image of the component after being sucked and as being held by the vacuum fastener, to provide a location signal responsive to the location of the component. An image signal processor provides an error signal according to the comparison of the location signal to a standard signal representing a standard location for the component. An NC numerical control device is connected to the signal processor to provide a correction signal for correcting the relative relation between the printed circuit board and the component. An XY table controlled in it, XY movement by the NC control device carries the circuit board such that the relative position between the component and the circuit board is adjusted according to outputs of the NC control device. The component has a magnetic mark at a predetermined location and the vacuum fastener has a magnetic sensor so that the component may be picked up by the vacuum fastener at a predetermined location by coinciding the magnetic sensor with the magnetic mark for preprocessing to locate the electronic component.</p>
申请公布号 CA1240403(A) 申请公布日期 1988.08.09
申请号 CA19850498551 申请日期 1985.12.24
申请人 TDK CORPORATION 发明人 HARADA, YOSHIO
分类号 B23P21/00;G05B19/408;H05K13/04;(IPC1-7):H05K3/30 主分类号 B23P21/00
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