APPARATUS FOR COOLING INTEGRATED CIRCUIT CHIPS

摘要

In the boiling type cooling semiconductor chips (2) mounted on printed circuit cards (1), a heat conductive stud (4) is attached to the surface of each chip (2). Cooling plates (3) with fins (6) so arranged to surround the circumference of each stud (4) are placed between the printed circuit cards (1) in order to condense the vapor bubbles produced near the studs (4).